BF620_622_3.PDF

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11068469 UNPDF
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D109
BF620; BF622
NPN high-voltage transistors
Product specification
Supersedes data of 1997 Apr 09
1999 Apr 21
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Philips Semiconductors
Product specification
NPN high-voltage transistors
BF620; BF622
FEATURES
PINNING
·
Low current (max. 50 mA)
PIN
DESCRIPTION
·
High voltage (max. 300 V).
1
emitter
2
collector
APPLICATIONS
3
base
·
Video output stages.
DESCRIPTION
handbook, halfpage
2
NPN high-voltage transistor in a SOT89 plastic package.
PNP complements: BF621 and BF623.
3
1
MARKING
TYPE NUMBER
MARKING CODE
1
2
3
BF620
DC
Bottom view
MAM296
BF622
DA
Fig.1 Simplified outline (SOT89) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V CBO
collector-base voltage
open emitter
BF620
-
300
V
BF622
-
250
V
V CEO
collector-emitter voltage
open-base
BF620
-
300
V
BF622
-
250
V
V EBO
emitter-base voltage
open collector
-
5
V
I C
collector current (DC)
-
50
mA
I CM
peak collector current
-
100
mA
I BM
peak base current
-
50
mA
P tot
total power dissipation
T amb £
25
°
C; note 1
-
1.25
W
T stg
storage temperature
-
65
+150
°
C
T j
junction temperature
-
150
°
C
T amb
operating ambient temperature
- 65
+150
° C
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm 2 .
For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.
1999 Apr 21
2
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Philips Semiconductors
Product specification
NPN high-voltage transistors
BF620; BF622
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R th j-a
thermal resistance from junction to ambient
note 1
100
K/W
R th j-s
thermal resistance from junction to soldering point
20
K/W
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm 2 .
For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.
CHARACTERISTICS
T j =25 ° C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I CBO
collector cut-off current
I E = 0; V CB = 200 V
-
10
nA
I E = 0; V CB = 200 V; T j = 150
°
C
-
10
m
A
I EBO
emitter cut-off current
I C = 0; V EB =5V
-
50
nA
h FE
DC current gain
I C = 25 mA; V CE =20V
50
-
V CEsat
collector-emitter saturation voltage I C = 30 mA; I B =5mA
-
600
mV
C re
feedback capacitance
I C =i c = 0; V CE = 30 V; f = 1 MHz
-
1.6
pF
f T
transition frequency
I C = 10 mA; V CE = 10 V; f = 100 MHz 60
-
MHz
1999 Apr 21
3
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Philips Semiconductors
Product specification
NPN high-voltage transistors
BF620; BF622
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 3 leads
SOT89
D
B
A
b 3
E
H E
L
1
2
3
b 2
c
w M
b 1
e 1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b 1
b 2
b 3
1.8
1.4
c
D
E
e
e 1
H E
4.25
3.75
L
min.
w
mm
1.6
1.4
0.48
0.35
0.53
0.40
0.44
0.37
4.6
4.4
2.6
2.4
3.0
1.5
0.8
0.13
OUTLINE
VERSION
REFERENCES
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT89
97-02-28
1999 Apr 21
4
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Philips Semiconductors
Product specification
NPN high-voltage transistors
BF620; BF622
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Apr 21
5
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