TDA8172.pdf

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TDA8172
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
. POWER AMPLIFIER
. THERMAL PROTECTION
DESCRIPTION
The TDA8172 is a monolithic integrated circuit in
HEPTAWATT TM package. It is a high efficiency
power booster for direct driving of vertical windings
of TV yokes. It is intended for use in Color and B &
W television as well as in monitors and displays.
HEPTAWATT
(Plastic Package)
ORDER CODE : TDA8172
PIN CONNECTIONS (top view)
7
6
5
4
3
2
1
NON-INVERTING INPUT
OUTPUT STAGE SUPPLY
OUTPUT
GROUND
FLYBACK GENERATOR
SUPPLY VOLTAGE
INVERTING INPUT
Tab connected to Pin 4
BLOCK DIAGRAM
+V S
2
6
3
F LYBACK
GENERATOR
1
P OWER
AMPLIFIER
5
7
THERMAL
P ROTECTION
TDA8172
4
May 1996
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. FLYBACK GENERATOR
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TDA8172
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V S
Supply Voltage (pin 2)
35
V
V 5 ,V 6
Flyback Peak Voltage
60
V
V 3
Voltage at Pin 3
+ V s
V 1 ,V 7
Amplifier Input Voltage
+ V s
– 0.5
V
I o
Output Peak Current (non repetitive, t = 2 ms)
2.5
A
I o
Output Peak Current at f = 50 or 60 Hz, t
3
10
m
s
3
A
I o
Output Peak Current at f = 50 or 60 Hz, t > 10
m
s
2
A
I 3
Pin 3 DC Current at V 5 <V 2
100
mA
I 3
Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, t fly
3
1.5 ms
3
A
P tot
Total Power Dissipation at T case =90
°
C
20
W
T stg ,T j
Storage and Junction Temperature
– 40, +150
°
C
THERMAL DATA
Symbol
Parameter
Value
Unit
R th (j–c)
Thermal Resistance Junction-case
Max.
3
°
C/W
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, V S = 35V, T amb =25 o C unless otherwise specified)
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit Fig.
I 2
Pin 2 Quiescent Current
I 3 =0,I 5 =0
8
16 mA 1a
I 6
Pin 6 Quiescent Current
I 3 =0,I 5 = 0
16
36
mA 1a
I 1
Amplifier Input Bias Current
V 1 = 1 V, V 7 = 2 V
– 0.1 – 1
m
Aa
1 = 2 V, V 7 = 1 V
– 0.1 – 1
m
Aa
3L
Pin 3 Saturation Voltage to GND
I 3 = 20 mA
1
1.5
V
1c
V 5
Quiescent Output Voltage
V s = 35V, R a =39k
W
18
V
1d
V 5L
Output Saturation Voltage to GND
I 5 = 1.2 A
1
1.4
V
1c
I 5 = 0.7 A
0.7
1
V
1c
V 5H
Output Saturation Voltage to Supply
– I 5 = 1.2 A
1.6
2.2
V
1b
–I 5 = 0.7 A
1.3
1.8
V
1b
T j
Junction Temperature for Thermal Shut Down
140
°
C
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383656089.003.png
TDA8172
Figure 1 : DC Test Circuits.
Figure 1 a : Measurement of I 1 ;I 2 ;I 6
Figure 1 b : Measurement of V 5H
V S
I 2
I 6
V S
2
6
2
6
V 5H
5
10k W
1
5
S1
a
1V
1
b
7
4
7
4
I 1
V 7
I 5
V 7
1V
S 1 : (a) I 2 and I 6 ; (b) I 1
Figure 1 c : Measurement of V 3L ;V 5L
Figure 1 d : Measurement of V 5
V S
V S
I 3
or
I 5
2
6
2
6
S1
12k W
3
a
1
5
b
2V
1
7
4
V 5
3V
V 7
5
R a
7
4
V 3L
V 5L
V 7
5.6k W
S 1 : (a) V 3L ; (b) V 5L
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383656089.004.png
TDA8172
Figure 2 : AC Test Circuit
1N4001
V S
C1
C2
C3
220
D1
0.1
m
F
470
F
m
F
t fly
2
63
Iy
V
7
V REF
7
TDA8 172
5
V i
R1
C4
0.22
to
Ly
GND
1
m
F
24.6mH
to
10kW
4
R7
1.5
R6
RT1
4.7k
W
W
330
W
Ry
9.6
W
R3
R4
IN
C6
4.7
12k
W
8.2k
R2
5.6k
m
F
C5
W
2200
m
F
R5 Iy
*
Re comme nde d for V
filtering
R5
to
REF
8.2
W
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATT TM package attaching
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient.
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is con-
nected to Pin 4 which is ground.
Figure 3 : Mounting Examples
4/5
m
W
383656089.005.png
TDA8172
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.8
0.189
C
1.37
0.054
D
2.4
2.8
0.094
0.110
D1
1.2
1.35
0.047
0.053
E
0.35
0.55
0.014
0.022
F
0.6
08
0.024
0.031
F1
0.9
0.035
G
2.41
2.54
2.67
0.095
0.100
0.105
G1
4.91
5.08
5.21
0.193
0.200
0.205
G2
7.49
7.62
7.8
0.295
0.300
0.307
H2
10.4
0.409
H3
10.05
10.4
0.396
0.409
L
16.97
0.668
L1
14.92
0.587
L2
21.54
0.848
L3
22.62
0.891
L5
2.6
3
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6
6.6
0.236
0.260
M
2.8
0.110
M1
5.08
0.200
Dia.
3.65
3.85
0.144
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
{
1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I 2 C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I 2 C Patent. Rights to use these components in a I 2 C system, is granted provided that the system confo rms to
the I 2 C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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