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LD-603 Series
LED displays
Flat displays
LD-603 Series
The LD-603 series were designed in response to the
need for large, flat displays. These are two-chip, flat
displays with high luminance.
External Dimensions (Units : mm)
15.0
13.8
±
0.2
13.8mm planar emission from two chips
connected in series.
2) High luminance, uniform planar emission
3) Thin outer casing, multiple units can be coupled
together.
4) Four colors are available : red, orange, yellow and
green.
×
(0.7)
Pin No.1
2
3
Cathode mark
Pin No.1 2 3
0.6
(2.5)
(2.5)
Tolerances are ±0.3 unless otherwise noted :
Selection guide
Emitting color
Type
∗
Red
LD-603VR
Orange
LD-603DU
∗
Yellow
LD-603YY
∗
Green
LD-603MG
Order-based production.
Absolute maximum ratings (Ta=25
°
C)
Parameter
Symbol
Red
LD-603VR Orange LD-603DU Yellow LD-603YY Green LD-603MG
Unit
Power dissipation
Forward current
Peak forward
current
Reverse voltage
Operating
temperature
Storage
temperature
P D
I F
120
20
60 ∗
120
20
120
20
150
25
mW
mA
I FP
60 ∗
60 ∗
60 ∗
mA
V R
3
3
3
3
V
Topr
−
25
∼+
75
˚C
Tstg
−
30
∼+
85
˚C
∗
Pulse width 1ms duty 1 / 5
Features
1) 6.8
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LD-603 Series
LED displays
Electrical and optical characteristics (Ta=25
°
C)
Red
Orange
Yellow
Green
Parameter
Symbol
Conditions
Unit
Min. Typ. Max. Min. Typ. Max.
5.6
Min. Typ. Max.
5.6
Min. Typ. Max.
5.6
Forward voltage
Reverse current
Peak wavelength
Spectral line half
width
Electrical and optical are guaranteed values per element.
V F
I R
λ
I F =10mA
V R =3V
I F =10mA
−
4.0
5.6
−
− −
4.0
−
− −
4.2
−
− −
4.2
V
µ
− −
10
10
−
10
−
10
−
A
nm
P
−
650
−
−
610
−
585
−
563
∆λ
I F =10mA
−
40
−
−
40
−
−
40
−
−
40
−
nm
Luminous intensity vs. wavelength
1.0
Green
Yellow
Orange
Red
0.8
0.6
0.4
0.2
0
500
550
600
650
700
750
Wavelength :
λ
P ( nm)
Luminous intensity
Color
Type
LD-603VR
LD-603DU
LD-603YY
LD-603MG
Min.
Typ.
Max.
Unit
mcd
mcd
mcd
mcd
Red
1.4
4.0
−
Orange
Yellow
Green
2.2
6.3
−
2.2
2.2
6.3
6.3
−
−
Note 1: Measured at I F = 10mA
Note 2: Current passes through 2 elements.
Operation notes
When forming leads, the bend should be at least 2 mm from the base of the package. Solder after forming the leads, and
ensure that the inside of the LED is not subjected to mechanical stress while it is hot.
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