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DL129/D
Rev. 7, Mar-2000
High-Speed CMOS Data
ON Semiconductor
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High–Speed CMOS Data
DL129/D
Rev. 7, Mar–2000
W SCILLC, 2000
Previous Edition W 1996
“All Rights reserved”
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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Table of Contents
Chapter 1. Function Selector Guide
Alphanumeric Index
Thermal Management
. . . . . . . . . . . . . . . . . . . . . . .
Capacitive Loading Effects on
Propagation Delay
41
. . . . . . . . . . . . . . . . . . . . . . . . .
6
. . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Effects on DC and AC
Parameters
43
Buffers/Inverters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
Gates
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Schmitt Triggers
10
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage Effects on Drive Current
and Propagation Delay
44
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
Bus Transceivers
. . . . . . . . . . . . . . . . . . . . . . . . . . .
12
. . . . . . . . . . . . . . . . . . . . . . .
44
Latches
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flip–Flops
13
Decoupling Capacitors
. . . . . . . . . . . . . . . . . . . . . . .
45
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Data Selectors/Multiplexers
14
Interfacing
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Parametric Values
46
. . . . . . . . . . . . .
Decoders/Demultiplexers/Display Drivers
16
. . . . . . . . . . . . . . . . . . . .
Reduction of Electromagnetic
Interference (EMI)
48
. . . . . . .
17
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Hybrid Circuit Guidelines
49
Analog Switches/Multiplexers/
Demultiplexers
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
. . . . . . . . . . . . . . . . . . . . .
49
Shift Registers
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
Schmitt–Trigger Devices
. . . . . . . . . . . . . . . . . . . . .
Oscillator Design with High–Speed CMOS
50
. . . . . .
51
Counters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Miscellaneous
21
RC Oscillators
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Crystal Oscillators
51
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2. Design Considerations
Introduction
22
. . . . . . . . . . . . . . . . . . . . . . . .
Printed Circuit Board Layout
51
. . . . . . . . . . . . . . . . . .
Definitions and Glossary of Terms
52
. . . . . . . . . . .
53
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Handling Precautions
24
HC vs. HCT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Glossary of Terms
53
. . . . . . . . . . . . . . . . . . . . . . . .
24
. . . . . . . . . . . . . . . . . . . . . . . .
Applications Assistance Form
53
Power Supply Sizing
. . . . . . . . . . . . . . . . . . . . . . . . .
28
. . . . . . . . . . . . . .
56
Battery Systems
. . . . . . . . . . . . . . . . . . . . . . . . . .
C PD Power Calculation
28
. . . . . . . . . . . . . . . . . . .
29
Chapter 3. Device Datasheets
Inputs
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Outputs
31
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
57
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–State Outputs
31
. . . . . . . . . . . . . . . . . . . . . . . . . .
Open–Drain Outputs
35
Chapter 4. Application Notes
. . . . . . . . . . . . . . . . . . . . . .
35
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
381
Input/Output Pins
. . . . . . . . . . . . . . . . . . . . . . . . .
35
Bus Termination
. . . . . . . . . . . . . . . . . . . . . . . . . .
Transmission Line Termination
36
Chapter 5. Ordering Information
Device Nomenclature
. . . . . . . . . . . . .
37
CMOS Latch Up
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Power Dissipation
38
. . . . . . . . . . . . . . . . . . . . . . .
398
. . . . . . . . . . . . . . . . . .
HC Quiescent Power Dissipation
40
Case Outlines
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
ON Semiconductor Major Worldwide
Sales Offices
398
. . . . . . . . . . .
40
HCT Quiescent Power Dissipation
. . . . . . . . . .
HC and HCT Dynamic Power Dissipation
40
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Document Definitions
405
. . . .
40
. . . . . . . . . . . . . . . . . . . . . .
406
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